I forgot to mention one thing. It's most often not a good idea to use an
800-degree soldering iron on circuit boards, as it may cause the copper pads to
lift away from the board. Use 700-degree or 600-degree. Whatever the
temperature, sufficient soldering will cause the pad to lift.
If you do have a lifted pad, carefully clean it and the board with a fiberglass
brush (to roughen the surfaces) and acetone (to remove any bits of solder
flux), and glue it back down with a tiny dab of 8-hour epoxy glue spread very
uniformly over mating surfaces. Hold the pad down with a bit of polyethylene
film and rubber, pressed down with a clamp or weight. Leave undistrubed for 24
hours at room temperature. The polyethylene film, to which the epoxy will not
stick, must be between pad/board and rubber.
If the trace to the pad broke, glue pad in place as described above, clean
trace and pad with the fiberglass brush, pre-tin trace and pad, and bridge the
gap by soldering a short piece of pre-tinned wire to trace and pad.
Joe Gwinn
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